Speaker: Prfessor Wenping Wang, the University of Hong Kong

Date: July 20, 2018

Time: 2:15 p.m. - 3:30 p.m.

Location: Meeting Room 202, Administration building, Software Park Campus

Sponsor: the School of Software

Abstract:

3D shape reconstruction has widespread applications in computer graphics, computer vision, robotics and virtual reality. However, the reconstruction of 3D wire objects has received relatively little research attention, despite of the ubiquity of these thin objects, such as ropes, cables, tree branches, wire arts and wire-frame furniture. This talk will present our recent works on an image-based reconstruction method and on using a hand-held commodity RGBD sensor for scanning and reconstructing wire objects with a skeleton-based fusion approach.

Bio:

Wenping Wang is Chair Professor of Computer Science at the University of Hong Kong. His research interests cover computer graphics, computer visualization, computer vision, robotics, medical image processing, and geometric computing, and he has published over 140 journal papers in these fields. He is journal associate editor of several international journals, including Computer Aided Geometric Design (CAGD), Computer Graphics Forum (CGF), IEEE Transactions on Computers, and IEEE Computer Graphics and Applications, and has chaired a number of international conferences, including Pacific Graphics 2012, ACM Symposium on Physical and Solid Modeling (SPM) 2013, and SIGGRAPH Asia 2013. Prof. Wang received the John Gregory Memorial Award for his contributions in geometric modeling. He is an IEEE Fellow.

For further information, please visit:

http://www.view.sdu.edu.cn/info/1020/107145.htm

Edited by: Xie Tingting